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 FDI8442 N-Channel PowerTrench(R) MOSFET
August 2007
FDI8442
N-Channel PowerTrench(R) MOSFET
40V, 80A, 2.9m
Features
Typ rDS(on) = 2.3m at VGS = 10V, ID = 80A Typ Qg(10) = 181nC at VGS = 10V Low Miller Charge Low Qrr Body Diode UIS Capability (Single Pulse and Repetitive Pulse) Qualified to AEC Q101 RoHS Compliant
Applications
Automotive Engine Control Powertrain Management Solenoid and Motor Drivers Electronic Steering Integrated Starter / Alternator Distributed Power Architectures and VRMs Primary Switch for 12V Systems
(c)2007 Fairchild Semiconductor Corporation FDI8442 Rev. A
1
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FDI8442 N-Channel PowerTrench(R) MOSFET
MOSFET Maximum Ratings TC = 25C unless otherwise noted
Symbol Drain to Source Voltage VDSS VGS ID EAS PD Gate to Source Voltage Drain Current Continuous (Tamb = 25oC, VGS = 10V, with RJA = 62oC/W) Pulsed Single Pulse Avalanche Energy Power Dissipation Derate above 25oC (Note 1) Drain Current Continuous (TC<158oC, VGS = 10V) Parameter Ratings 40 20 80 23 See Figure 4 720 254 1.7 -55 to +175 mJ W W/oC
oC
Units V V A
TJ, TSTG Operating and Storage Temperature
Thermal Characteristics
RJC RJA Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient (Note 2) 0.59 62
oC/W oC/W
Package Marking and Ordering Information
Device Marking FDI8442 Device FDI8442 Package TO-262 Reel Size Tube Tape Width N/A Quantity 50 units
Electrical Characteristics TJ = 25C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS IDSS IGSS Drain to Source Breakdown Voltage Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250A, VGS = 0V VDS = 32V VGS = 0V VGS = 20V TJ = 150C 40 1 250 100 V A nA
On Characteristics
VGS(th) rDS(on) Gate to Source Threshold Voltage Drain to Source On Resistance VDS = VGS, ID = 250A ID = 80A, VGS = 10V ID = 80A, VGS = 10V, TJ = 175C 2 2.9 2.3 3.9 4 2.9 5.0 m V
Dynamic Characteristics
Ciss Coss Crss RG Qg(TOT) Qg(TH) Qgs Qgs2 Qgd Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge at 10V Threshold Gate Charge Gate to Source Gate Charge Gate Charge Threshold to Plateau Gate to Drain "Miller" Charge VDS = 25V, VGS = 0V, f = 1MHz VGS = 0.5V, f = 1MHz VGS = 0 to 10V VGS = 0 to 2V VDD = 20V ID = 80A Ig = 1mA 12200 1040 640 1.0 181 23 49 26 41 235 30 pF pF pF nC nC nC nC nC
FDI8442 Rev. A
2
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FDI8442 N-Channel PowerTrench(R) MOSFET
Electrical Characteristics TJ = 25C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Switching Characteristics
t(on) td(on) tr td(off) tf toff Turn-On Time Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Turn-Off Time VDD = 20V, ID = 80A VGS = 10V, RGS = 2 19.5 19.3 57 17.2 62 118 ns ns ns ns ns ns
Drain-Source Diode Characteristics
VSD trr Qrr Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovery Charge ISD = 80A ISD = 40A IF = 75A, di/dt = 100A/s IF = 75A, di/dt = 100A/s 0.9 0.8 49 70 1.25 1.0 64 91 V V ns nC
Notes: 1: Starting TJ = 25oC, L = 0.35mH, IAS = 64A 2: Pulse width = 100s.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/ All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
FDI8442 Rev. A
3
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FDI8442 N-Channel PowerTrench(R) MOSFET
Typical Characteristics
POWER DISSIPATION MULIPLIER
1.2
ID, DRAIN CURRENT (A)
300 250 200 150 100 50 0 25
CURRENT LIMITED BY PACKAGE VGS = 10V
1.0 0.8 0.6 0.4 0.2 0.0
0
25
50 75 100 125 150 TC, CASE TEMPERATURE(oC)
175
50
75
100
125
150
175
TC, CASE TEMPERATURE(oC)
Figure 1. Normalized Power Dissipation vs Case Temperature
2 1
NORMALIZED THERMAL IMPEDANCE, ZJC
DUTY CYCLE - DESCENDING ORDER
D = 0.50 0.20 0.10 0.05 0.02 0.01
Figure 2. Maximum Continuous Drain Current vs Case Temperature
0.1
PDM
t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC
0.01
SINGLE PULSE
1E-3 -5 10
10
-4
Figure 3. Normalized Maximum Transient Thermal Impedance
10000
VGS = 10V
10 10 10 t, RECTANGULAR PULSE DURATION(s)
-3
-2
-1
10
0
10
1
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS:
IDM, PEAK CURRENT (A)
1000
I = I25
175 - TC 150
100
SINGLE PULSE
10 -5 10
10
-4
10 10 10 t, RECTANGULAR PULSE DURATION(s)
-3
-2
-1
10
0
10
1
Figure 4. Peak Current Capability
FDI8442 Rev. A
4
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FDI8442 N-Channel PowerTrench(R) MOSFET
Typical Characteristics
4000
500
10us 100us
1000
ID, DRAIN CURRENT (A)
IAS, AVALANCHE CURRENT (A)
100
If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
100
STARTING TJ = 25 C
o
10
LIMITED BY PACKAGE
10
STARTING TJ = 150 C
o
1
1ms
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on) SINGLE PULSE TJ = MAX RATED o TC = 25 C
10ms DC
0.1
1
10 VDS, DRAIN TO SOURCE VOLTAGE (V)
100
1 0.01
0.1 1 10 100 tAV, TIME IN AVALANCHE (ms)
1000 5000
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 5. Forward Bias Safe Operating Area
Figure 6. Unclamped Inductive Switching Capability
160
VGS = 10V PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
160 ID, DRAIN CURRENT (A)
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 5V
ID, DRAIN CURRENT (A)
120
120
VGS = 5V VGS = 4.5V
80
TJ = 175oC TJ = 25oC TJ = -55oC
80
40
40
VGS = 4V
0 2.0
2.5 3.0 3.5 4.0 4.5 VGS, GATE TO SOURCE VOLTAGE (V)
5.0
0
0
1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V)
5
Figure 7. Transfer Characteristics
Figure 8. Saturation Characteristics
rDS(on), DRAIN TO SOURCE ON-RESISTANCE (m)
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
50 40 30 20
TJ = 25oC TJ = 175oC
1.8 1.6 1.4 1.2 1.0 0.8 0.6 -80
ID = 80A VGS = 10V
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
10 0
4
6 7 8 9 VGS, GATE TO SOURCE VOLTAGE (V)
5
10
-40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC)
200
Figure 9. Drain to Source On-Resistance Variation vs Gate to Source Voltage
Figure 10. Normalized Drain to Source On Resistance vs Junction Temperature
FDI8442 Rev. A
5
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FDI8442 N-Channel PowerTrench(R) MOSFET
Typical Characteristics
NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE
1.2 1.1
NORMALIZED GATE THRESHOLD VOLTAGE
VGS = VDS ID = 250A
1.10
ID = 250A
1.0 0.9 0.8 0.7 0.6 0.5 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) 200
1.05
1.00
0.95
0.90 -80
-40
0
40
80
120
160
200
TJ, JUNCTION TEMPERATURE (oC)
Figure 11. Normalized Gate Threshold Voltage vs Junction Temperature
40000
Ciss
Figure 12. Normalized Drain to Source Breakdown Voltage vs Junction Temperature
10
ID = 80A
VGS, GATE TO SOURCE VOLTAGE(V)
CAPACITANCE (pF)
10000
Coss
8 6 4 2 0
VDD = 15V VDD = 20V VDD = 25V
1000
Crss
100 0.1
f = 1MHz VGS = 0V
1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
50
0
50 100 150 Qg, GATE CHARGE(nC)
200
Figure 13. Capacitance vs Drain to Source Voltage
Figure 14. Gate Charge vs Gate to Source Voltage
FDI8442 Rev. A
6
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FDI8442 N-Channel PowerTrench(R) MOSFET
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R)
(R)
Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FPSTM FRFET(R) Global Power ResourceSM
Green FPSTM Green FPSTM e-SeriesTM GTOTM i-LoTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R)
(R)
PDP-SPMTM Power220(R)
Power247(R) POWEREDGE(R) Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM The Power Franchise(R)
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM SerDesTM UHC(R) UniFETTM VCXTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I31
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
FDI8442 Rev. A
7
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